Blog Posts

Fidelis has worked hand in hand with PEs since it’s inception back in 2019. We’ve gone above and beyond to provide on-demand engineering simulation solutions to PEs that just don’t have the capability or capacity that they require and, in turn, our PE partners have provided stamp and seal services where we are not covered

Simulation-driven design isn’t just for big metal structures anymore. Printed circuit boards (PCBs) are now carrying higher power densities, more delicate packages, and tighter allowable margins on reliability. As a result, thermal and dynamic (vibration/shock) substantiation of boards has become a first-class engineering task rather than an afterthought. What Is PCB Thermal & Vibration Analysis?

In electromagnetic simulations performed in specialized tools such as CST Studio Suite, a port is a defined interface through which electromagnetic energy enters or exits the system. It serves as a connection point between the device and the external environment, enabling the excitation of the model or the measurement of its response. Ports represent the

Electromagnetic (EM) simulation involves using computational models to predict how electric and magnetic fields interact with various materials, components, and structures by solving Maxwell’s equations. Instead of relying on physical prototypes, we can employ these simulations to analyze and visualize how electromagnetic waves propagate and behave in complex environments. This approach streamlines the design and

Electromagnetic (EM) waves are transverse waves formed by the oscillation of electric and magnetic fields that are perpendicular to each other and to the direction of wave travel. Unlike mechanical waves like sound or water waves which travel through matter by molecular collisions, EM waves do not need a physical medium and can travel through

Hyperelastic materials undergo large deformations without any permanent damage and return to their initial state when unloaded. This behavior arises from their highly elastic molecular structure, which allows the material to store and release significant amounts of strain energy. The unique property for hyperelastic materials comes from their distinct molecular arrangement composed of long, flexible,

The fundamental equation governing linear static problems in Finite Element Analysis (FEA) tools like Abaqus is KU = F, where the global stiffness matrix (K) multiplied by the unknown displacement vector (U) equals the external force vector (F). This equation captures the complete physical behavior of the system, including material stiffness, geometric properties of the

In a CFD simulation (see FMK in the 3DEXPERIENCE and PowerFLOW) that involves wall-bounded flows, it is crucial to accurately predict the behavior of the turbulent boundary layer. Accurate prediction of the turbulent boundary layer dictates the ability of the CFD simulation to accurately predict forces exerted by the fluid on the solid surfaces such

Fatigue refers to weakening of the material when subjected to repeated loads. In real life scenario, take a paperclip which is robust and strong at the beginning of its life. But when it is used repeatedly, you observe that it becomes easier and easier to bend. It might eventually break at a force far less

Creep failure occurs in a material when it is subjected to constant load over prolonged periods of time. This is permanent deformation occurring in the material due its inherent atomic or molecular structure. This failure occurs when the stresses are well below the yield stress of the material. Understanding and accounting for creep behavior is