Technology is getting smaller, more powerful and faster. Moreover, the power is often in the palm of the hand. This brings with it both structural and thermal challenges and, using FEA, Fidelis would relish the chance to help you solve them.
The critical conditions necessary at the heart of modern electronics require carefully mapped out environments. The systems become more complex and the pressure to bring them to market becomes more intense. Finite element analysis can be utilized to quickly iterate and optimize in tight time-frames.
Whether it's the structural analysis of a server tower or the thermal analysis of a smart watch, Fidelis has the knowledge and experience to help high-tech companies manage highly complex simulation challenges.
When you collaborate with the Fidelis team, you get what YOU need. We take great care in understanding the engineering challenges that you're facing and are passionate about seeking the most innovative solutions. With decades of experience creating, running and post-processing finite element models, we're confident that we can become your trusted simulation partner.